Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

ABSTRACT

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

TECHNICAL FIELD OF THE INVENTION

The present invention generally relates to apparatus and methods forintegrally packaging semiconductor IC (integrated circuit) chips withantenna structures that are formed using chip package lead wires, tothereby provide highly-integrated radio/wireless communications systemsfor millimeter wave applications.

BACKGROUND

Technological innovations in wireless systems and devices have lead towidespread development of wireless network applications for wireless PAN(personal area network), wireless LAN (local area network), wireless WAN(wide area network), cellular networks, and other types of wirelesscommunication systems. To enable wireless communication between devicesin a wireless network, the devices must be equipped with receivers,transmitters, or transceivers, as well as antennas that can efficientlyradiate/receive signals transmitted to/from other devices in thenetwork.

Conventional radio communication systems are typically constructed usingdiscrete components that are individually encapsulated and/or mountedwith low integration levels on printed circuit boards, packages orsubstrates. For example, FIG. 1 schematically illustrates a conventionalradio communication system (10). The system (10) comprises a leaded chippackage (11) with an integrated circuit chip (12) and protruding packageleads (13). The package leads (13) are connected to interconnectstructures (14) that are formed on a PCB (printed circuit board) orprinted wiring board, for example. The interconnect structures (14)provide electrical connections to a transmitter or receiver antenna (15)(such as a printed antenna structure formed on the board level). Theelectrical interconnects (14) are typically built using expensive andbulky wave guides and/or package-level or board-level micro stripstructures.

There is an increasing market demand, however, for more compact radiocommunication systems with integrated transmitter/receiver/transceiverand antenna systems, which provide high-performance, high datatransmission rate, high-volume, low-power consumption, low cost, and lowweight solutions. Indeed, current communication systems require highperformance antenna systems that provide, e.g., wide bandwidth,high-gain, and high-efficiency operating characteristics. As theoperating frequency increases, the manufacture and assembly ofconventional waveguide front-ends become more difficult. In this regard,innovations in semiconductor fabrication and packaging technologies,coupled with requirements for higher operating frequencies, have made itpractically feasible for integrating antennas with RF integratedcircuits to provide highly integrated radio communication systems.

SUMMARY OF THE INVENTION

In general, exemplary embodiments of the invention include apparatus andmethods for integrally packaging semiconductor IC (integrated circuit)chips with antennas that are formed using chip package leads asradiating elements, to thereby provide highly-integrated radio/wirelesscommunications systems for millimeter wave applications.

In one exemplary embodiment, an electronic apparatus includes an IC(integrated circuit) chip and an antenna system, wherein the IC chip andantenna system are integrally packaged together in a leaded chip-scalepackage. The antenna system includes an antenna having a radiatingelement that is formed from a package lead wire. The radiating elementmay be a straight lead wire, a lead wire having at least one bend or aninverted gull wing lead wire, for example. In another exemplaryembodiment, the antenna includes a tuning element formed from a packagelead wire disposed in proximity to the radiating element. In yet anotherexemplary embodiment, the apparatus includes an integrated antenna feednetwork having an on-chip feed structure formed on an active surface ofthe IC chip and a wire bond connecting the on-chip feed structure to oneend of the radiating element. The on-chip feed structure may be a CPW(coplanar waveguide which includes a center conductor wire bondconnected to the radiating element of the antenna, and first and secondground elements disposed on, and spaced apart from, opposite edges ofthe center conductor. The antenna system my have a tuning element formedfrom a lead wire disposed in proximity to the radiating element, whereinthe tuning element is wire bonded to one of the first and second groundelements of the CPW.

In another exemplary embodiment, the on-chip feed structure includes abalanced differential feed line including first and second coplanar feedlines, wherein the radiating element of the antenna is wire bonded tothe first feed line. The antenna may further comprise a second radiatingelement wire bonded to the second feed line, wherein the first andsecond radiating element together form a balanced antenna structure suchas a dipole. In another embodiment, the antenna may include a tuningelement formed from a lead wire disposed in proximity to the radiatingelement, wherein the tuning element is wire bonded to the second feedline.

In another exemplary embodiment of the invention, a wirelesscommunication apparatus is provided, which includes a printed circuitboard, and a chip package mounted to the printed circuit board. The chippackage comprises an IC (integrated circuit) chip and antenna systemintegrally packaged together in a leaded chip-scale package, wherein theantenna system comprises an antenna having a radiating element that isformed from a package lead wire. In another embodiment, the printedcircuit board includes a metallic ground structure that functions as anantenna ground element, a radiation reflector, or both.

In various embodiments of the invention, the radiating element may be astraight, open-ended lead wire that extends substantially parallel to,and spaced apart from, a metallic ground element, or the radiatingelement may be a close-ended lead wire having a bent portion connectedto the metallic ground element, or the radiating element may be anopen-ended inverted gull wing lead wire disposed over the metallicground element. In other exemplary embodiments of the invention, theantenna may include one or more close-ended and/or open-ended tuningelements disposed in proximity to one or more radiating elements.

These and other exemplary embodiments, aspects, objects, features andadvantages of the present invention will be described or become apparentfrom the following detailed description of exemplary embodiments, whichis to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically illustrates a conventional radio communicationsystem.

FIG. 2 is a high-level schematic illustration of an apparatus forintegrally packaging an IC chip and antenna structure formed from one ormore package lead wires, according to an exemplary embodiment of theinvention.

FIGS. 3A and 3B schematically illustrate an electronic package apparatusaccording to an exemplary embodiment of the invention, for integrallypackaging an IC chip and antenna structure formed from one or morepackage lead wires.

FIGS. 4A and 4B depict exemplary layout and structural dimensions forthe exemplary package structure of FIGS. 3A and 3B to form an integratedradio communication system operating at a frequency of about 60 GHz.

FIGS. 5A and 5B schematically illustrate a grounded coplanar wave guidestructure according to an exemplary embodiment of the invention.

FIG. 6A schematically illustrates an integrated antenna system accordingto an exemplary embodiment of the invention.

FIG. 6B graphically illustrates a simulated return loss of the antennastructure of FIG. 6A.

FIG. 6C graphically illustrates a simulated radiating efficiency of theexemplary antenna system of FIG. 6A.

FIG. 7A schematically illustrates an integrated antenna system accordingto an exemplary embodiment of the invention.

FIG. 7B graphically illustrates a simulated return loss of the antennastructure of FIG. 7A.

FIG. 8A schematically illustrates an integrated antenna system accordingto an exemplary embodiment of the invention.

FIG. 8B graphically illustrates a simulated return loss of the antennastructure of FIG. 8A.

FIG. 9A schematically illustrates an integrated antenna system accordingto an exemplary embodiment of the invention.

FIG. 9B graphically illustrates a simulated return loss of the antennastructure of FIG. 9A.

FIGS. 10A and 10B schematically illustrate an integrated antenna systemaccording to an exemplary embodiment of the invention.

FIG. 10C graphically illustrates a simulated return loss of the antennastructure of FIGS. 10A˜B.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

FIG. 2 is a high-level schematic illustration of an apparatus forintegrally packaging IC chips and antennas according to an exemplaryembodiment of the invention. In particular, FIG. 2 depicts an apparatus(20) comprising a chip scale package structure (21) comprising an ICchip (22) and antenna (23) that is formed from one or more package leadwires of a lead frame of the package (21). The IC chip (22) may comprisea radio communication system-on-chip including an integrated receiver,transmitter or transceiver system, which operates at millimeter wavefrequencies (e.g., 20 GHz and greater). The IC chip (22) may compriseother integrated RF active or passive devices/circuits such as antennafeeds, transmission lines, low noise amplifiers, filters, etc.

In accordance with exemplary embodiments of the invention, various typesof leaded package technologies can be used to form package lead framestructures having one or more package lead wires that are sized, shapedand/or arranged to form an antenna structure. In general, leaded chippackages are typically named based on the shape of the lead wires, e.g.,gull-wing leads, J-leads, C-leads, or straight I-leads. During a chippackaging process, the package lead wires are typically shaped after apackage molding process. The package lead wires are initially formed asstraight wires that are mechanically supported with a metal ringattached to the component body, which protects the lead wires fromdamage during handling. Subsequently, the ring is excised using asuitable tool and the package leads are shaped using a universal trimand form device.

It is to be appreciated that during a lead forming process, one or morelead wires can be sized, shaped and arranged to form an antennastructure having desired antenna characteristics such as resonantoperating frequency, radiation efficiency, gain, operation bandwidth,etc. The lead wire(s) can be designed with a given length such that mostof the lead wire(s) protrudes from, and is not covered by, lossyinsulation material that is used to form the package mold (orencapsulation). Indeed, lead wires can be shaped and sized to asradiating elements which protrude from the package structure such thatmost of the antenna area is surrounded by air.

In other exemplary embodiments described in further detail, antennastructures with lead wire antenna elements can be designed inconjunction with board-level ground planes and/or ground connections, ifnecessary. In particular, depending on the application, lead wireantenna elements can be terminated on the board-level with an open orshort circuit to provide required boundary conditions. A board-levelground plane can be used as a ground termination for an antenna leadwire elements, can operate as an antenna ground plane for monopoleradiators, and can operate as a reflecting surface to direct radiationin a given direction.

In other exemplary embodiments of the invention described in detailbelow, antenna structures can be formed using one or more grounded oropen-ended lead wire elements (tuning elements) that are disposed inproximity to a radiating lead wire element for purposes of tuning theantenna to achieve desired antenna properties. The lead wire tuningelements can be sized, shaped and arranged for purposes of controllingantenna impedance, increasing antenna bandwidth, control antennaradiation patterns, etc.

FIGS. 3A and 3B schematically illustrate an electronic package apparatus(30) according to an exemplary embodiment of the invention, forintegrally packaging an IC chip and antenna structure formed from one ormore package lead wires. FIG. 3A is a top plan view of the apparatus(30) and FIG. 3B is a side-view of the apparatus (30) along line 3B-3Bin FIG. 3A. The apparatus (30) comprises a package mold (31) (or packageencapsulation), a carrier substrate (32) (or package frame structure),an IC chip (33), a plurality of package lead wires (34), (35), (36), andwire bond connections (37, (38). The electronic package (30) is depictedas being mounted to a PCB (printed circuit board) (39) having a metallicground plane (39 a) on a surface thereof. The metallic ground plane (39a) can serve as an antenna ground plane and/or radiation reflector.

The carrier substrate (32) and lead wires (34), (35) and (36) are partof a metallic lead frame structure that is formed using known techniques(e.g., etching, stamping). The die paddle (32) serves to mechanicallysupport the IC chip (33) during package manufacture. The IC chip (33) isbackside mounted to the substrate (32) during a die mounting processusing known techniques. The IC chip (33) (or die) may comprise anintegrated radio communications system (e.g., receiver, transmitter,transceiver, etc.). The lead wires (34), (35) and (36) are connected toappropriate bond pads on the active surface of the chip (33) by wirebonds (37) and (38) during a wire bonding process. The lead wires (34)provide I/O connections and power supply connections between externalwiring/pads on the PCB (39) and BEOL (Back-end-of-line) pads/wiring onthe active surface of the IC chip (33).

Further, in the exemplary embodiment of FIGS. 3A and 3B, the packagelead wire (36) is formed to operate as a radiating element of an antennastructure. The package lead wire (36) is shaped as an inverted gull-winglead, although this is merely exemplary and other lead wire shapes arepossible to form antenna radiating elements. In other exemplaryembodiments of the invention, a plurality of lead wires can be formed asradiating elements to construct various types of antenna structuresincluding, for example, antenna arrays or multi-band antennas, etc.

As noted above, antenna structures according to exemplary embodiments ofthe invention can be formed using one or more grounded or open endedlead wire elements that are disposed in proximity to a radiating leadwire element for purposes of tuning the antenna to achieve desiredantenna properties. For example, in the exemplary embodiment of FIGS.3A/3B, the lead wires (35) may be used as antenna tuning elementsdisposed on either side of the radiating element (36) and connected tothe ground plane (39 a) of the PCB (39). The lead wire elements (35) aresized, shaped and arranged for purposes of controlling antennaimpedance, increasing antenna bandwidth, control antenna radiationpatterns, etc. In the exemplary embodiment of FIGS. 3A/3B, the antennastructure with radiating element (36) and tuning elements (35) is formedin conjunction with the board-level ground plane (39 a) formed on thePCB (39), where the radiating element (36) is open-ended with respect tothe ground plane (39 a) and the tuning elements (35) having terminatingends that are short-circuited to the ground plane (39 a) (or groundpads/contacts). Again, depending on the application, the lead wires thatform an antenna structure can be terminated on the board-level with anopen or short circuit to provide required boundary conditions. Antennastructures according to other exemplary embodiments of the inventionwhich utilize board-level ground structures will be discussed below withreference to the exemplary embodiment depicted in FIGS. 6A, 7A, 8A, 9Aand 10A, for example.

According to further embodiments of the invention, integratedchip-to-antenna connections are realized in an impedance-controlledfashion by feed networks that are constructed with bond wires andon-chip feed structures to provide a desired antenna input impedance.For example, antenna feed networks according to exemplary embodiments ofthe invention include on-chip feed structures, such as CPW (coplanarwave guide), differential feed lines, etc, which are formed as part ofBEOL metallization of an IC chip, and bond wires to connect the on-chipfeed structures to lead wire antenna elements. Integrated antennasystems having on chip feed structures that are formed from on-chip feedstructures and bond wires according to exemplary embodiments of theinvention will be discussed below with reference to the exemplaryembodiments depicted in FIGS. 6A, 7A, 8A, 9A and 10A, for example.

FIGS. 4A and 4B illustrate dimensions of the electronic packageapparatus (30) depicted in FIGS. 3A and 3B, for constructing anintegrated radio communications system that operates at a fundamentalfrequency of about 60 GHz. In the exemplary embodiment, the package mold(31) is depicted as having a thickness of 1 mm, a length of 5 mm, and apackage offset of 100 microns. The package mold (31) can be formed of amaterial (plastic, epoxy) preferably having a relatively low dielectricconstant and relatively low dielectric loss. The lead wire elements(34), (35) and (36) are formed of copper (or other suitable metallicmaterial) and have a width of 300 microns, while the width of the bondwire (37) is 50 microns. The ground plane (39 a) formed on the surfaceof the PCB (39) is disposed below the antenna lead wire elements (35)and (36). The overall length of the lead wire elements (35) and (36) is2.2 mm and are separated by a pitch of 500 microns. The length of anupper bent portion (36 a) of the element (36), which has an exemplarylength of 600 microns, affects the resonant frequency. The 1.2 mmspacing between the upper bent portion (36 a) and the ground plane (39a) affects the bandwidth of the antenna. The antenna lead wire elements(35), (36) are connected to an antenna feed network formed by bond wires(37) and an on-chip feed structure (e.g., CPW) on the active surface ofthe chip (33).

FIGS. 5A and 5B schematically illustrate an antenna feed structureaccording to an exemplary embodiment of the invention. In particular,FIGS. 5A and 5B illustrate coplanar waveguide (CPW) structure forimplementing an unbalanced feed network for feeding antenna structuresformed with package lead wires, according to an exemplary embodiment ofthe invention. FIG. 5A is a plan view of a CPW feed (50) structure whichcomprises a center conductor (50 a) separated from a pair of groundelements (50 b, 50 c). The elements (50 a, 50 b and 50 c) of the CPW(50) are coplanar (formed on same plane). The CPW (50) can be formedon-chip as part of an upper metallization layer of a BEOL interconnectstructure. FIG. 5B schematically illustrates the CPW feed structureembedded in a center plane region (50′) of a dielectric medium (51). Thedielectric medium (51) is disposed over a ground plane (59 a) of a PCB(59).

Computer simulations were performed for a CPW feed structure having theexemplary structural dimensions shown in FIGS. 5A and 5B to provide a 75ohm CPW. In the exemplary embodiment of FIG. 5A, the center conductor(50 a) was defined having a length of 500 microns and width of 100microns. The ground elements (50 b) and (50 c) were defined havingsimilar dimensions length×width of 500 microns×500 microns. The centerconductor (50 a) was spaced apart from each ground element (50 b) and(50 c) by 50 microns. In FIG. 5B, the dielectric medium (51) was definedhaving a thickness of 1 mm and spaced apart from the ground plane (59 a)by 100 microns. The CPW feed structure (50) was spaced apart from theground plane (59 a) by a distance of 600 microns. The dielectric medium(51) was defined as being formed of a material with a dielectricconstant of 2.7 and loss tangent of 0.04.

It is to be appreciated that a CPW structure, such as depicted in FIG.5A, together with wire bonds, can be used to form antenna feed networksfor unbalanced feeding of antennas that are formed from lead wireelements. For instance, various antenna systems designed with open-endedand grounded lead wire antenna elements fed by CPW feed networks, willbe discussed with reference to the exemplary embodiments of FIGS. 6A,7A, 8A and 9A. For purposes of determining electrical performance,properties and characteristics of the exemplary CPW fed antennastructures of FIGS. 6A, 7A, 8A and 9A, computer simulations wereperformed based on exemplary dimensions of the antenna elements and feedstructures depicted in FIGS. 6A, 7A, 8A and 9A for a fundamentaloperating frequency of about 60 GHz. The results of the computersimulations will be discussed below with reference to FIGS. 6B, 6C, 7B,8B and 9B. For each of the computer simulations, the antenna CPW feedstructures in FIGS. 6A, 7A, 8A and 9A were assumed to be embedded in adielectric medium and spaced from a ground plane as per the exemplarydimensions and dielectric characteristics as discussed with reference toFIG. 5B.

FIG. 6A schematically illustrates an integrated antenna system accordingto an exemplary embodiment of the invention. In particular, FIG. 6Aillustrates an antenna feed network (60) comprising a CPW structure (61)and wire bond (62), which feeds an antenna structure comprising aradiating element (65). In the exemplary embodiment, the radiatingelement (65) is a straight, open-ended package lead wire that isdisposed parallel to and separated from a ground plane (64). The CPWstructure (61) comprises a center conductor (61 a) and adjacent groundelements (61 b) and (61 c). The wire bond (62) provides an electricalconnection between the center conductor (61 a) of the CPW (60) and oneend (fed end) of the lead wire radiating element (65). The antenna feednetwork (60) and fed end of the radiating element (65) are embeddedwithin a dielectric medium (63).

FIG. 6A illustrates exemplary layout and structural dimensions that weredefined for computer simulation of the antenna system of FIG. 6A for anoperating frequency of about 60 GHz. In FIG. 6A, the antenna element(65) was defined having a length of 2050 microns. In the exemplaryembodiment, the length L1, which includes the wire bond (62) and aportion of element (65) (embedded in the dielectric (63)) is selected tobe about one-quarter wavelength of the operating frequency, and thelength L2 is selected to be about one-half wavelength of the operatingfrequency. The elements of the CPW structure (61) were defined to havethe same planar dimensions as discussed with reference to FIG. 5A, withthe CPW structure (61) being disposed from side of the dielectric medium(63) by 1500 microns. The dielectric medium (63) was defined having thatthickness and spacing dimensions as depicted in FIG. 5B.

FIGS. 6B and 6C illustrate simulation results for the exemplary antennasystem of FIG. 6A. In particular, FIG. 6B graphically illustrates asimulated return loss of the antenna structure normalized to 31 Ohmsand, in particular, the simulated return loss (S11) in dB for afrequency range of 50-70 GHz. The simulation results in FIG. 6Billustrate a bandwidth of at least 4 GHz, wherein bandwidth is definedbased on the frequency range for which S₁₁ was measured to be about −10dB or better. FIG. 6C graphically illustrates a simulated radiatingefficiency of the exemplary antenna system of FIG. 6A over the frequencyrange of 50˜70 GHz. The results of the simulation illustrate a radiationefficiency of 80% or better over the frequency range of 59-64 GHz.

FIG. 7A schematically illustrates an integrated antenna system accordingto another exemplary embodiment of the invention. In particular, FIG. 7Aillustrates an antenna feed network (70) comprising a CPW structure (71)and wire bond (72), which feeds an antenna comprising radiating element(75). In the exemplary embodiment, the radiating element (75) is agrounded lead wire having a straight portion of length L disposedparallel to and separated from a ground plane (74), and an unfed(terminating) end that is bent toward and connected to the ground plane(74). The CPW structure (71) comprises a center conductor (71 a) andadjacent ground elements (71 b) and (71 c). The wire bond (72) providesan electrical connection between the center conductor (71 a) of the CPW(70) and one end of the lead wire radiating element (75). The antennafeed network (70) and fed end portion of the radiating element (75) areembedded within a dielectric medium (73). Unlike the antenna structurein FIG. 6A, where the radiation pattern has only one horizontalpolarization, the antenna in FIG. 7A has both horizontal and verticalpolarizations.

FIG. 7A illustrates exemplary layout and structure dimensions that weredefined for computer simulation of the antenna system of FIG. 7A for anoperating frequency of about 60 GHz. In FIG. 7A, the antenna element(75) was defined having a length L of 3050 microns. In the exemplaryembodiment, the length L1, which includes the wire bond (72) and aportion of element (75) (embedded in the dielectric (73)) is selected tobe about one-quarter wavelength of the operating frequency, and thelength L2 is selected to be about three-quarters wavelength of theoperating frequency. The CPW structure (71) was defined being disposedfrom side of the dielectric structure (73) by 1500 microns, but having anarrower dimension of 600 microns (as compared to the 1200 microns ofthe CPW structure (60) of FIG. 6A). The dielectric medium (73) wasdefined having the exemplary thickness and spacing dimensions asdepicted in FIG. 5B.

FIG. 7B illustrates the simulation results for the exemplary antennasystem of FIG. 7A. In particular, FIG. 7B graphically illustrates asimulated return loss of the antenna structure normalized to 37 Ohmsand, in particular, the simulated return loss (S11) in dB for afrequency range of 50-70 GHz. The simulation results in FIG. 7Billustrate a bandwidth of at least 2.5 GHz, wherein bandwidth is definedbased on the frequency range for which S₁₁ was measured to be about −10dB or better.

FIG. 8A schematically illustrates an integrated antenna system accordingto another exemplary embodiment of the invention. In particular, FIG. 8Aillustrates an antenna feed network (80) comprising a CPW structure (81)and wire bonds (82) and (87), which feeds an antenna structurecomprising a radiating element (85) and a tuning element (86) formedfrom package leads. The CPW structure (81) comprises a center conductor(81 a) and adjacent ground elements (81 b) and (81 c). The wire bond(82) provides an electrical connection between the center conductor (81a) of the CPW (80) and one end of the radiating element (85). The wirebond (87) provides an electrical connection between the ground element(81 b) of the CPW (80) and the tuning element (86). The antenna feednetwork (80) and fed ends of the radiating and tuning elements (85) and(86) are embedded within a dielectric medium (83).

In the exemplary embodiment of FIG. 8A, the radiating element (85) is anopen-ended, straight package lead wire that is disposed parallel to andseparated from a ground plane (84). Moreover, the tuning element (86) isan open-ended straight package lead wire that extends parallel to, andspaced apart from, both the ground plane (84) and the antenna radiatingelement (85). As compared to the antenna system of FIG. 6A, the antennasystem of FIG. 8A includes the tuning element (86) disposed in proximityto the radiating element (85) as a means to adjust the antenna resonatefrequency and impedance due to the EM coupling between the antennaelements (85) and (86).

FIG. 8A illustrates exemplary layout and structure dimensions that weredefined for computer simulation of the antenna system of FIG. 8A for anoperating frequency of about 60 GHz. In FIG. 8A, the antenna radiatingelement (85) was defined having a length of 2050 microns and the antennatuning element (86) was defined having a length of 1500 microns.Moreover, the dimensions of the ground elements (81 b) and (81 c) of theCPW structure (81) were dissimilar, with the ground element (81 b)connected to the tuning antenna element (86) being wider than the groundelement (81 c). The dielectric medium (83) was defined having theexemplary thickness and spacing dimensions as depicted in FIG. 5B.

FIG. 8B illustrates the simulation results for the exemplary antennasystem of FIG. 8A. In particular, FIG. 8B graphically illustrates asimulated return loss of the antenna structure normalized to 31 Ohmsand, in particular, the simulated return loss (S11) in dB for afrequency range of 50˜70 GHz. The simulation results in FIG. 8Billustrate a bandwidth of at least 4 GHz, wherein bandwidth is definedbased on the frequency range for which S₁₁ was measured to be about −10dB or better. Comparing the simulation results depicted in FIGS. 6B and8B, it is shown that the additional lead wire tuning element (86)proximately disposed to the radiating element (85) results in a shift inthe antenna resonate frequency and impedance.

FIG. 9A schematically illustrates an integrated antenna system accordingto another exemplary embodiment of the invention. In particular, FIG. 9Aillustrates an antenna feed network (90) comprising a CPW structure (91)and wire bonds (92), (97) and (99), which feeds an antenna structurecomprising a radiating element (95) and tuning elements (96) and (98)formed by package lead wires. The CPW structure (91) comprises a centerconductor (91 a) and adjacent ground elements (91 b) and (91 c). Thewire bond (92) provides an electrical connection between the centerconductor (91 a) of the CPW (91) and one end of the radiating element(95). The wire bond (97) provides an electrical connection between theground element (91 b) of the CPW (91) and the antenna tuning element(96). The wire bond (99) provides an electrical connection between theground element (91 c) of the CPW (91) and the antenna tuning element(98). The antenna feed network (90) and fed ends of the radiating andtuning elements (95), (96) and (98) are embedded within a dielectricmedium (93).

In the exemplary embodiment of FIG. 9A, the radiating element (95) isformed from an open-ended, straight lead wire that is disposed parallelto and separated from a ground plane (94). Moreover, the tuning elements(96) and (98) are formed from open-ended straight lead wires that extendparallel to the ground plane (94) and on opposite sides of the antennaradiating element (95). As compared to the antenna system of FIG. 8A,the antenna system of FIG. 9A includes a plurality of tuning elements(96) and (98) disposed in proximity to, and on opposite sides of, theradiating element (95) as a means to adjust the antenna resonatefrequency and impedance due to the EM coupling between the antennaelements (95) and (96) and (98).

FIG. 9A illustrates exemplary layout and structure dimensions that weredefined for computer simulation of the antenna system of FIG. 9A for anoperating frequency of about 60 GHz. In FIG. 9A, the antenna element(95) was defined having a length of 2050 microns and the antenna tuningelements (96) and (98) were defined having a length of 1500 microns.Moreover, the dimensions of the ground elements (91 b) and (91 c) of theCPW structure (91) were similarly defined. The dielectric medium (93)was defined having the exemplary thickness and spacing dimensions asdepicted in FIG. 5B.

FIG. 9B illustrates the simulation results for the exemplary antennasystem of FIG. 9A. In particular, FIG. 9B graphically illustrates asimulated return loss of the antenna structure normalized to 31 Ohmsand, in particular, the simulated return loss (S11) in dB for afrequency range of 50-70 GHz. The simulation results in FIG. 8Billustrate a bandwidth of at least 2.5 GHz, wherein bandwidth is definedbased on the frequency range for which S₁₁ was measured to be about −10dB or better. Comparing the simulation results depicted in FIGS. 6B, 8Band 9B, it is shown that the additional lead wire element (99)proximately disposed to the radiating element (92) results in a shift inthe antenna resonate frequency and impedance.

FIGS. 10A and 10B schematically illustrate an integrated antenna systemaccording to another exemplary embodiment of the invention. Inparticular, FIG. 10A illustrates an antenna feed network (1000)comprising a balanced differential feed lines (1001) and wire bonds(1002) and (1007), which feeds an antenna structure comprising aradiating element (1005) and a tuning element (1006) formed from packageleads. The differential feed structure (1001) comprises two coplanarfeed lines (1001 a) and (1001 b). The wire bond (1002) provides anelectrical connection between differential line (1001 a) and one end ofthe radiating element (1005). The wire bond (1007) provides anelectrical connection between the differential line (1001 b) and thetuning element (1006). The antenna feed network (1000) and fed ends ofthe radiating and tuning elements (1005) and (1006) are embedded withina dielectric medium (1003).

FIG. 10B is a perspective view of the exemplary antenna system of FIG.10A. In the exemplary embodiment of FIG. 10B, the radiating element(1005) is an open-ended, package lead wire that is shaped as an invertedgull wing lead having a straight portion (1005 a), and bent portions(1005 b) and (1005 c). Moreover, the tuning element (1006) is anclose-ended package lead wire having a straight portion (1006 a) whichextends parallel to, and spaced apart from, both the ground plane (1004)and the portion (1005 a) of the radiating element (1005). In addition,the tuning element (1006) has a bent portion (1006 b) which extends downfrom the end of the straight portion (1006 a) towards the ground plane(1004) and contacts the ground plane (1004).

FIGS. 10A and 10B illustrate exemplary layout and structure dimensionsthat were defined for computer simulation of the antenna system for anoperating frequency of about 60 GHz. In FIG. 10A, the antenna radiatingelement (1005) was defined having a length (in the x direction) of1300+200+200 microns and the antenna tuning element (1006) was definedhaving a length (in the x direction) of 1300+200 microns. Moreover, thebalanced feed lines (1001 a, 1001 b) are separated by a pitch of 150microns (where the pitch can be modified to tune the feed lineimpedance). An exemplary offset distance was defined to be 175 microns.This offset distance can be varied to adjust a separation between (1005)and (1006) to thereby tweak the antenna performance. An exemplary lengthof 400 microns was defined between the wirebonds (1002) and (1007) inthe “x” direction between feedline (1001) and lead wires (1005, 1006)(which length can be varied to change the antenna resonant frequency.)The dielectric medium (1003) was defined having the exemplary thicknessand spacing dimensions as depicted in FIG. 5B.

FIG. 10C illustrates the simulation results for the exemplary antennasystem of FIGS. 10A and 10B. In particular, FIG. 10C graphicallyillustrates a simulated return loss of the differential fed antennastructure normalized to 150 Ohms and, in particular, the simulatedreturn loss (S11) in dB for a frequency range of 50˜70 GHz. Thesimulation results in FIG. 10C illustrate a bandwidth of at least 6 GHz,wherein bandwidth is defined based on the frequency range for which S₁₁was measured to be about −10 dB or better. Comparing the simulationresults depicted in FIGS. 6B, 7B, 8B, 9B and 10C, it is shown that thedifferential fed antenna structure provides a relatively wider operatingbandwidth mainly due to the relatively large separation between theradiating element (1005) and the ground plane (1004).

In another exemplary embodiment of the invention, the antenna frameworkof FIGS. 10A and 10B can be modified such that element (1006) is notgrounded, but rather the elements (1005) and (1006) are formed into abalanced antenna structure such as a dipole antenna fed by the balanceddifferential line. For example, the leads (1005) and (1006) can be bentaway from each other in opposite directions in the y direction to form ahalf-wavelength dipole radiator.

The integrated antenna systems discussed above are merely exemplaryembodiments to illustrate the use of package lead wires to form antennastructures. Based on the teachings herein, one of ordinary skill in theart can readily envision other embodiments in which one or more leadwires can be formed to operate as antenna radiating elements to formantenna structures including, for example, antenna arrays and multibandantenna structures and wherein one or more package lead wires are formedto operate as antenna tuning elements to control antenna impedance, toincrease antenna bandwidth or control antenna radiation patterns. Theexemplary antenna structures discussed above are meant to illustrate theflexibilities of the antenna design with lead wires, and should not beconstrued as limiting the scope of the claimed inventions. For instance,in the exemplary embodiments of FIGS. 8A and 9A, the tuning elements canbe formed instead as radiating elements having resonant frequencies thatenable multi-band operation. By way of specific example, in FIG. 8A, theelements (85) and (86) can be separate radiating elements havingresonant frequencies in different frequency bands to provide dual-bandoperation, and the elements (95), (96) and (98) in FIG. 9A can beseparate radiating elements having resonant frequencies in differentfrequency bands to provide tri-band operation.

Those of ordinary skill in the art will readily appreciate the variousadvantages associated with antennas and integrated antenna packagesaccording to embodiments of the invention. For instance, exemplaryantenna designs which are integrally formed using package lead wiresusing known techniques enables high-volume antenna manufacturingcapability. Moreover, integrated IC packages according to exemplaryembodiments of the invention enable antennas to be integrally packagedwith IC chips such as transceiver chips, which provide compact designswith very low loss between the transceiver and the antenna. Moreover,the use of integrated antenna/IC chip packages according to the presentinvention saves significant space, size, cost and weight, which is apremium for virtually any commercial or military application.

Although exemplary embodiments have been described herein with referenceto the accompanying drawings for purposes of illustration, it is to beunderstood that the present invention is not limited to those preciseembodiments, and that various other changes and modifications may beaffected herein by one skilled in the art without departing from thescope of the invention.

1. An electronic apparatus, comprising: an IC (integrated circuit) chip;and an antenna system, wherein the IC chip and antenna system areintegrally packaged together in a leaded chip-scale package, and whereinthe antenna system comprises an antenna having a radiating element thatis formed from a package lead wire.
 2. The apparatus of claim 1, whereinthe radiating element is a straight lead wire.
 3. The apparatus of claim1, wherein the radiating element is a lead wire having at least onebend.
 4. The apparatus of claim 1, wherein the radiating element is aninverted gull wing lead wire.
 5. The apparatus of claim 1, wherein theantenna comprises a tuning element formed from a package lead wiredisposed in proximity to the radiating element.
 6. The apparatus ofclaim 1, further comprising an integrated antenna feed network, theintegrated antenna feed network comprising an on-chip feed structureformed on an active surface of the IC chip and a wire bond connectingthe on-chip feed structure to one end of the radiating element.
 7. Theapparatus of claim 6, wherein the on chip feed structure comprises a CPW(coplanar waveguide), the CPW including a center conductor wire bondconnected to the radiating element of the antenna, and first and secondground elements disposed on, and spaced apart from, opposite edges ofthe center conductor.
 8. The apparatus of claim 7, wherein the antennafurther comprises a tuning element formed from a lead wire disposed inproximity to the radiating element, wherein the tuning element is wirebonded to one of the first and second ground elements of the CPW.
 9. Theapparatus of claim 6, wherein the on-chip feed structure comprises abalanced differential feed line comprising first and second coplanarfeed lines, wherein the radiating element of the antenna is wire bondedto the first feed line.
 10. The apparatus of claim 9, wherein theantenna further comprises a second radiating element wire bonded to thesecond feed line, wherein the first and second radiating element form abalanced antenna structure such as a dipole.
 11. The apparatus of claim9, wherein the antenna comprises a tuning element formed from a leadwire disposed in proximity to the radiating element, wherein the tuningelement is wire bonded to the second feed line.
 12. A wirelesscommunication apparatus, comprising: a printed circuit board; and a chippackage mounted to the printed circuit board, the chip packagecomprising an IC (integrated circuit) chip and antenna system integrallypackaged together in a leaded chip-scale package, wherein the antennasystem comprises an antenna having a radiating element that is formedfrom a package lead wire.
 13. The apparatus of claim 12, wherein theprinted circuit board comprises a metallic ground structure thatfunctions as an antenna ground element, a radiation reflector, or both.14. The apparatus of claim 13, wherein the radiating element is astraight lead wire that extends substantially parallel to, and spacedapart from, a metallic ground element.
 15. The apparatus of claim 13,wherein the radiating element is a lead wire having a bent portionconnected to the metallic ground element.
 16. The apparatus of claim 13,wherein the radiating element is an open-ended inverted gull wing leadwire disposed over the metallic ground element.
 17. The apparatus ofclaim 13, wherein the antenna comprises a tuning element formed from apackage lead wire disposed in proximity to the radiating element,wherein at least a portion of the tuning element extends substantiallyparallel to a portion of the radiating element.
 18. The apparatus ofclaim 17, wherein the tuning element has a bent portion that isconnected to the metallic ground element.
 19. The apparatus of claim 12,further comprising an integrated antenna feed network, the integratedantenna feed network comprising an on-chip feed structure formed on anactive surface of the IC chip and a wire bond connecting the on-chipfeed structure to one end of the radiating element.
 20. The apparatus ofclaim 19, wherein the on chip feed structure comprises a CPW (coplanarwaveguide), the CPW including a center conductor wire bond connected tothe radiating element of the antenna, and first and second groundelements disposed on, and spaced apart from, opposite edges of thecenter conductor.
 21. The apparatus of claim 19, wherein the on-chipfeed structure comprises a balanced differential feed line comprisingfirst and second coplanar feed lines, wherein the radiating element ofthe antenna is wire bonded to the first feed line.
 22. A method forconstructing an electronic package apparatus, comprising integrallypackaging an IC chip and antenna together in a leaded chip-scale packagewherein the antenna is formed from one or more package lead wires. 23.The method of claim 22, comprising: forming a lead frame structurehaving a plurality of lead wires; and shaping at least one lead wire toform an antenna radiating element.
 24. The method of claim 23, furthercomprising shaping at least one lead wire to form an antenna tuningelement disposed in proximity to the antenna radiating element.